Residual Stress Measurement

 

Residual stress measurement inside metal components.

 

  X-ray diffraction is used to measure the residual stress inside mechanical components and other building objects.  MIRRORCLE uses high-energy white X-ray, which enable deep and non-destructive measurements. Furthermore, the energy dispersive method allows measuring of complex shapes.

 

 

 

Residual stress distribution measurement instrument apparatus:

 

 

 

 

X-ray source MIRRORCLE-CV1

X-ray energy

10〜100keV

Optical system Parallel optical system
Detector Germanium semiconductor detector
Sample shape Arbitrary
X-ray diameter Less than 500μm(※)
Measurement region Less than 1cm(※)
Maximum measurement depth Less than 1mm for steel(※)
Depth resolution Greater than 1μm(※)

※Depends on conditions of measurement                        

 

 

 

 

 

 

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